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BOND Scholarship Program

  • Maximum Amount
    $10,000
  • Number Of Awards
    1
  • Contact
    Scholarship Committee
    BOND
    6205 Santa Monica Blvd
    Los Angeles, CA 90038
    karina@bondcreativemgmt.com
  • Website Address
    https://bondcreativemgmt.com/bcap.html
  • Scholarship Description
    BOND views its influence and expertise as a platform for investing in the success of young BIPOC creatives. The BOND Creative Advancement Project (BCAP) was therefore launched as a multi-level approach to fostering inclusivity within the creative industries through both its scholarship and mentorship program. Helmed by a Black-owned organization and certified diversity supplier, BCAP is outfitted to consult with companies of creative and cultural influence on achieving long term, sustainable DEI solutions. Scholarships to design schools are challenging for any American student to obtain but present further hurdles for BIPOC American students.
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    The BOND Scholarship Program, a component of BCAP, was established as a solution in accelerating the next generation into becoming the future leaders of tomorrow on a global scale. Applicants must be a BIPOC Community member, be a US Citizen or permanent resident and must be enrolled full-time in a university-level fashion program. For more information or to apply, please visit the scholarship provider's website.

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