Packaging Engineer Scholarship

  • Maximum Amount
  • Application Deadline
    November 02, 2022
  • Number Of Awards
  • Contact
    Ryan Erickson
    4334 Brockton Drive SE Suite E
    Kentwood, MI 49512
  • Website Address
  • Scholarship Description
    Packaging Compliance Labs is offering a scholarship for packaging engineers for Winter 2021. The winner will be awarded a $2,000 scholarship towards their packaging engineering education. This scholarship is available for packaging engineering college students who are enrolled in any college/university with a packaging engineering program.

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