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Honorable William C. Conner Writing Competition

  • Maximum Amount
    $1,500
  • Application Deadline
    February 27, 2023
  • Number Of Awards
    2
  • Contact
    Scholarship Committee
    605 Third Avenue
    New York, NY 10158
    rbrown@daypitney.com
  • Website Address
    https://www.nyipla.org/nyipla/ConnerWritingAwards....
  • Scholarship Description
    The Honorable William C. Conner Writing Competition was established to recognize exceptionally written papers that are submitted by law students and is presented each year at the Annual Meeting and Awards Dinner.
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    The competition is open to students enrolled in a J.D. or LL.M. program (day or evening). The subject matter must be directed to one of the traditional subject areas of intellectual property, i.e., patents, trademarks, copyrights, trade secrets, unfair trade practices, antitrust, and data security/privacy issues. For more information or to apply, please visit the scholarship provider's website.

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