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Honorable William C. Conner Writing Competition

  • Maximum Amount
    $1,500
  • Application Deadline
    March 04, 2020
  • Number Of Awards
    2
  • Contact
    Lea Tejada
    2125 Center Avenue
    Suite 406
    Fort Lee, NJ 07024
    admin@nyipla.org
  • Website Address
    https://www.nyipla.org/nyipla/ConnerWritingAwards....
  • Scholarship Description
    The Hon. William C. Conner Writing Competition was established to recognize exceptionally written papers that are submitted by law students and is presented each year at the Annual Meeting and Awards Dinner. The competition is open to students enrolled in a J.D. or LL.M. program (day or evening). The subject matter must be directed to one of the traditional subject areas of intellectual property, i.e., patents, trademarks, copyrights, trade secrets, unfair trade practices, antitrust, and data security/privacy issues. For more information and details, please visit the scholarship provider's website.

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